Manufacturer | Chip Quik Inc. |
Form | Spool, 0.35 oz (10g) |
Type | Wire Solder |
Process | Lead Free |
Diameter | 0.040" (1.02mm) |
Flux Type | No-Clean, Rosin Activated (RA) |
Mesh Type | - |
Shelf Life | - |
Wire Gauge | 18 AWG, 19 SWG |
Composition | Bi57Sn42Ag1 (57/42/1) |
Melting Point | 280°F (138°C) |
Product Status | Active |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |